Applications Condensation cure encapsulant and potting compound HY-215 :
It is mainly applied for the surface of polycarbonate, PP, ABS,
PVC, metal etc., which is suitable for the electronic
moisture-proof and waterproof, fixed. It is applicable to sealing
bonding coating LED for electronic parts.
Features Condensation cure encapsulant and potting compound HY-215 :
Condensation cure encapsulant and potting compound HY-215 is tow-component condensation cure silicone with the
characteristics of low viscosity, easy pouring operation, good
bonding feature. The safety of potting compound silicone can reach
the EU-ROHS requirements fully.
Using instruction of Condensation cure encapsulant and potting compound HY-215 :
1. First stir the Part A completely before using(to be sure the
segiment is evenly mixted) to mixing the Part B as Part A.
2. Mix the Part A and Part B completely according to the mix
ratio(10:1by weight) and can be used after deaired
3. this product can be vulcanized at room temperature. After basic
curing then go to the next step. Full curing process will be within
24h.The enviromental temperature, especially the humidity, will
affect the curing time greatly. Customers should make appropriate
adjustments according to local conditions. The mixed silicone
should be finished at one time to avoid any waste of material.